ITC Asia Roadshow - India

Insuretech Connect Asia 2023

ITC Asia Roadshow - India

Next Stop: Mumbai, India

Agenda

As the world of insurance continues to change, it's more important than ever to stay ahead of the latest trends and insights. That's why we're excited to invite you to the 2022 ITC Asia Roadshow. This event will bring together entrepreneurs, insurance leaders, and investors to highlight the latest insights, spur new connections, and create new opportunities.

With a focus on insurance innovation that creates growth, this roadshow will provide you with the chance to hear from industry leaders about the latest trends and what they mean for the future of insurance. Don't miss this opportunity to stay ahead of the disruption – register today!

Date
8 December 2022

Venue
Jio World Convention Centre

Agenda
12.00pm - Registration and Networking (Light Refreshments provided)
01.00pm - ITC Asia Roadshow Opening
01.05pm - Opening Remarks
01.10pm - Keynote Address
01.20pm - Keynote CXO Panel Discussion: How the insurance players can come together to increase insurance penetration
02.00pm - CTO Panel Discussion: How Data and Tech Enable Digital Growth
02.40pm - VC Panel Discussion: Investor's perspective on Insurtech in India
03.20pm - Break
03.40pm - Panel Discussion: Product innovation in insurance - Opportunities & Challenges
04.20pm - Pitch Sessions by Insurtech
05.00pm - Networking Session (Light Refreshments provided) 

Speakers



If you have any questions, please contact us at asia@insuretechconnect.com

Sponsors

Thought Leadership Sponsor

Supporting Partners


 

Registration Form

The roadshow is free to attend for all and we have limited slots available. Priority will be given to senior-level executives (managers and above) from insurers and insurtechs. As slots are limited, each company should only send a maximum of 5 (five) senior representatives.

Complete the form below to register for the event. Please note that your registration is not confirmed until you receive a confirmation e-mail from us.